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緊湊型開放式樣品載入原子層沉積（ALD）系統(tǒng)

OpAL提供了專業(yè)的熱ALD設(shè)備，可以簡單明了的升***使用等離子體，使得在同***緊湊設(shè)備中集成了等離子體和熱ALD。

· 開放式樣品載入熱ALD，集成等離子體技術(shù)

· 現(xiàn)場升***到可使用等離子體

· 從小晶片到200mm大晶片

適用于學(xué)術(shù)、產(chǎn)業(yè)、研發(fā)的熱和/或等離子體化學(xué)產(chǎn)品，可用于：

氧化物： HfO2, Al2O3, TiO2, SiO2, ZnO, Ta2O5
氮化物：TiN, Si3N4
金屬： Ru, Pt

ALD應(yīng)用舉例：

· 納米電子學(xué)

· 高k柵極氧化物

· 存儲電容器絕緣層-銅連線間的高縱橫比擴(kuò)散勢壘區(qū)

· 有機(jī)發(fā)光二極管和聚合物的無針孔鈍化層

· 鈍化晶體硅太陽能電池

· 應(yīng)用于微流體和MEMS的高保形涂層

· 納米孔結(jié)構(gòu)的涂層

· 生物微機(jī)電系統(tǒng)

· 燃料電池

直觀性強(qiáng)的的軟件提高性能

使用與牛津儀器的值得信賴的Plasmalab ®產(chǎn)品***族相同的軟件平臺， OpAL的程序驅(qū)動、多用戶***別、PC2000TM控制的軟件易于操作且可為快速ALD做相應(yīng)修改。

OpAL provides professional thermal ALD equipment that can be easily upgraded using plasma so that plasma ａnd thermal ALD are integrated in the same compact device.

· open sample loading ALD, integrated plasma technology

· upgrade the site to use plasma

· small to 200mm chips

Thermal and/or plasma chemical products suitable for academic, industrial, research ａnd development use:

Oxides: HfO2, Al2O3, TiO2, SiO2, ZnO, Ta2O5

Nitride: TiN, Si3N4

Metal: Ru, Pt

ALD application examples:

· nano electronics

· high k gate oxides

· high aspect ratio diffusion barrier area between storage capacitor insulation layer ａnd copper wire

· pinhole-free passivation layer for organic light-emitting diodes ａnd polymers

· passivated crystalline silicon solar cells

· high conformal coatings for microfluidics ａnd MEMS applications

· coating of nanopore structure

· biological micro-electromechanical system

· fuel cell

Intuitive software improves performance

Using the same software platform as Oxford instruments＇ trust-worthy Plasmalab ® family of products, OpAL＇s program-driven, multi-user level, PC2000TM controlled software is easy to operate ａnd can be modified for fast ALD.